Steps in the PCB lamination process

1. Clean the panel to remove corrosion, dry film, defoaming residue, dry film peeling and any fingerprints.

2. Using standard brown or black oxide treatment can be micro-etched, thereby reducing the thickness of the copper. The oxide treatment is used for the epoxy resin to provide better adhesion while avoiding problems such as delamination.

3. The inner layer and prepreg are stacked on the gluing machine, and then they are glued together.

4. After gluing, by connecting the inner layer to the prepreg, use rivets (along the edge of the unusable board) to complete the positioning and reinforce the PCB. This can strengthen the laminate and ensure that it will not move during the PCB lamination process. The stainless steel patch and prepreg sandwich the copper foil to complete the stack.

5. The stack is then placed at extreme temperatures, the exact temperature?? depends on the materials used in the data sheet. Apply pressure of more than 33,000 lbf/ft2 (approximately 180 tons per square meter) for up to two hours.

6. After being exposed to high pressure and high temperature, the layer is moved to a cold press, then demolded and an X-ray machine is used to prepare registration holes.

7. Finally, burr the panel, and then round its four corners.

Substrates and laminates are essentially the foundation of the circuit board and provide structural integrity to the PCB. However, the laminate itself can also be used as a core material in some structures. Like the substrate, the laminate can be customized to meet specific requirements.

Tensile strength and shear strength are also important in the PCB lamination process. The coefficient of thermal expansion (CTE) and glass transition temperature (Tg) both help to improve the reliability of the circuit board. CTE refers to the expansion rate of the PCB material when heated, and since the CTE of the substrate is much higher than that of copper, connection problems may occur when the PCB is heated. Tg corresponds to the temperature at which the materials within the PCB become mechanically unstable.

Since the substrate and laminate are the basis of the circuit board, it is very important to choose the best material. It is this material that will determine the thermal, electrical and mechanical properties of the finished PCBA.

Ensure the quality during PCB lamination

Modern electronic products have forced the exponential development of PCBA. Users are clamoring for lighter weight, faster speed, better functions, longer service life, higher reliability, and smaller size. As a result, circuit board lamination affects the function and life of PCBA, which is why you should be careful when choosing circuit board materials.